Intel hits record after Trump posts Apple-Intel chip claim

Intel shares rose 3.9% on Monday to an intraday record of $141.45 after former President Donald Trump posted on Truth Social that Apple had agreed to work with Intel to design and build chips in the United States. Neither Apple nor Intel confirmed the arrangement.

The stock had surged on Thursday, closing at a then-record $133.99 after a one-day gain of about 10.6%. Monday extended a multi-session rally tied to investor interest in Intel’s plans for contract manufacturing and advanced packaging.

Mizuho raised its price target on Intel to $135 from $128 while keeping a Neutral rating. The firm highlighted Intel’s EMIB-T and Foveros packaging technologies and estimated they could enable the company to capture roughly 10% to 15% of the advanced packaging market over time.

Mizuho hosted an expert call that compared EMIB-T with other 2.5D approaches and noted that glass substrate technology is beginning to emerge with potential benefits for thermal performance and denser wiring. The discussion also covered 3D integration methods such as Foveros and SoIC for vertical stacking.

The firm cited supply-chain constraints, naming ABF as a bottleneck with one major supplier, and identified Amkor Technology as a glass substrate partner for Intel. Mizuho said demand for through-silicon via drilling, lithography and other wafer fabrication equipment could rise, naming Lam Research, KLA and Applied Materials as possible beneficiaries.

On the “No Priors” podcast, CEO Lip-Bu Tan said, “My goal is a tenfold return for shareholders within five to ten years.” Tan joined Intel early last year and has sought investments and government support for the company’s foundry plans.

Over the past 12 months, Intel shares have risen more than 540% and are up over 250% year to date. TipRanks data show 11 of 38 analysts rate the stock a buy while 25 maintain a hold rating.

Observers noted remaining questions about execution, supply-chain constraints and the timeline for broader commercial adoption of advanced packaging technologies.

EMIB-T and Foveros are Intel methods for connecting chips horizontally and vertically. CoWoS-L is a 2.5D packaging approach used by other foundries. Glass substrates and hybrid bonding are among technologies being explored to increase interconnect density and improve thermal performance in multi-chip packages.