ASML shares climb as Samsung, TSMC back High NA EUV
ASML shares rose after Samsung and TSMC pledged to adopt the company’s High-NA EUV systems; Samsung plans DRAM use from 2028 and TSMC will begin logic deployment in 2030.
ASML’s shares rose after Samsung and Taiwan Semiconductor Manufacturing Co. announced plans to adopt the company’s High-NA EUV lithography systems. Samsung said it will use High-NA EUV for DRAM production starting in 2028. TSMC said it will begin deploying the machines for advanced logic from 2030, initially using existing 6-inch photomasks. U.S.-listed ASML shares gained about 3% in premarket trading, while Amsterdam-listed stock was up just over 1%.
High-NA EUV systems print smaller and more detailed circuit patterns on silicon wafers than current EUV tools, which can reduce the need for multiple patterning steps during manufacturing. Each High-NA machine carries an approximate price tag of $400 million.
TSMC had previously expressed caution about High-NA, saying productivity advantages did not yet justify the cost. The company’s revised timeline reflects a reassessment of those trade-offs. TSMC represents about 16% of ASML’s revenue. Intel has also been identified among early users of High-NA equipment.
ASML plans to demonstrate a pilot production line using larger, 12-inch photomasks by 2031 and expects the technology to be ready for high-volume production by 2033. The company is working with Samsung and TSMC on the 12-inch mask format. ASML’s chief technology officer, Marco Pieters, estimated that adopting the larger masks could raise system productivity by roughly 40%.
Market analysts said the customer commitments clarify the pace of High-NA adoption. Barclays wrote the announcements should provide more visibility on adoption. BofA Global Research maintained a Buy rating on ASML with a price target of €2,452 and projects a stronger revenue growth profile for ASML compared with many peers. Consensus estimates cited by analysts show about 27% compound annual revenue growth for ASML versus a 22% peer average.
ASML raised its financial guidance for 2026 and plans to increase total EUV capacity by about 30% in 2027. Analysts noted that stronger customer commitments could lead the company to consider further capacity expansion. With Samsung, TSMC and Intel aligning on High-NA timetables, ASML has increased visibility into potential demand for its next-generation machines.








